Flexible Electronics News

Henkel Highlights New Technologies at IPC APEX Expo 2019

Will show new interconnect, thermal and protection materials.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

At this year’s IPC APEX Expo, taking place Jan. 29-31 in San Diego, CA, Henkel Corporation will debut several new materials.   At Henkel’s booth, visitors can learn more about:  • New LOCTITE solder materials and fluxes for automotive applications. • Low pressure molding TECHNOMELT to facilitate automated masking of keep out zones prior to conformal coating processes. • BERGQUIST thermal control solutions in liquid and pad formats ensure effective heat dissipation for increased reliability....

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